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| 1/8 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. s t epping mot o r driver series high performance, high reliability 36v s t epping motor driver series bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm desc ri ptio n bd6387efv, bd6385efv, bd6383efv, bd6389fm are the high-grade type that provides the hi ghest function and highest reliance in the rohm stepping motor driver series. this series has the perfect various protec tion circuits and reduces ics generation of heat by adopting low-on resistanc e dmos and high heat-radiation power package. as for its basic function, it is a low power consumption bi polar pwm constant current-drive driver with power supply s rated voltage of 36v and rated output current of 1.0a 2.2a. for the input interface, the cl k-in drive mode and the parallel in drive mode are compatible with each other, so please choose an input mode according to needs of application. there are excitation modes of full step & half step (2 kinds), quarter step mode, and for current decay mode, the ratio of fast decay & slow decay can be freely set, so the optimum control conditions for every motor can be realized. in addition, being able to drive with one system of power su pply makes contribution to the set designs getting easy. f e atu r e 1) power supply: one system drive (rated voltage of 36v) 2) rated output current: 1.0a, 1.5a, 2.0a, 2.2a 3) low on resistance dmos output 4) clk-in drive mode (built-in translator circuit) 5) parallel in drive mode 6) stepping motor dc motor( 2) drives are selectable 7) pwm constant current control (self oscillation) 8) built-in spike noise cancel function (external noise filter is unnecessary) 9) full step & half step (two kinds), applicable to quarter step 10) applicable to the step drive 11) current decay mode switching function (l inearly variable fast/slow decay ratio) 12) normal rotation & reverse rotation switching function 13) power save function 14) built-in logic input pull-down resistor 15) power-on reset function 16) thermal shutdown circuit (tsd) 17) over current protection circuit (ocp) 18) under voltage lock out circuit (uvlo) 19) over voltage lock out circuit (ovlo) 20) malfunction prevention at the time of no app lied power supply (ghost supply prevention) 21) electrostatic discharge: 6kv (hbm specification) 22) adjacent pins short protection 23) inverted mounting protection 24) microminiature, ultra-thin and high heat-radiation (exposed metal type) htssop package (bd6387efv/bd6385efv/bd6383efv) 25) fin heat-radiating type hsop package (bd6389fm) 26) pin-compatible line-up (bd6387efv/bd6385efv/bd6383efv or bd6389fm) a p p lic ati on ppc, multi-function printer, laser beam printer, ink jet prin ter, monitoring camera, web ca mera, sewing machine, photo printer, fax, scanner, mini printer, toy, and robot etc. no.12009eat04 downloaded from: http:///
technical note 2/8 bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. a b s o lute maximum r a tings(t a= 25 ) item symbol bd6387efv bd6385efv bd6383efv bd6389fm unit supply voltage v cc0,1,2 -0.2 +36.0 v power dissipation pd 1.6 1 2.8 3 w 4.7 2 5.2 4 w input voltage for control pin v in -0.2 +5.5 v rnf maximum voltage v rnf 0.5 v maximum output current i out 2.0 5 1.5 5 1.0 5 2.2 5 a/phas e operating temperature range t opr -25 +75 storage temperature range t stg -55 +150 junction temperature t jmax 150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 12.8mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 37.6mw/ for operating above ta=25 . 3 70mm 70mm 1.6mm glass epoxy board. derating in done at 22.4mw/ for operating above ta=25 . 4 4-layer recommended board. derating in done at 41.6mw/ for operating above ta=25 . 5 do not, however exceed pd, aso and t jmax =150 . o per ati ng c o n d i tio n s( t a = -25 +75 ) item symbol bd6387efv bd6385efv bd6383efv bd6389fm unit supply voltage v cc0,1,2 10 28 v output current(dc) i out 1.7 6 1.2 6 0.7 6 1.9 6 a/phas e 6 do not however exceed pd, aso. e l ectr ic al c h a r act e rist ics applicable to all the series (unless otherwise specified ta=25 , vcc0,1,2=24v) item symbol limit unit condition min. typ. max. w h ol e circuit current at standby i ccst - 1.0 3.0 ma ps=l circuit current i cc - 4.5 10 ma ps=h, vrefx=2v c o ntrol in put (se l e c t , cw_c cw , clk, ps, mode 0, mode1, e n able) h level input voltage v inh 2.0 - - v l level input voltage v inl - - 0.8 v h level input current i inh 35 50 85 a v in =5v l level input current i inl -10 0 - a v in =0v out put (out 1a, out 1 b, out 2 a, o u t 2 b) output on resistance (bd6387efv) r on - 0.8 1.04 i out = 1.5a, sum of upper and lower output on resistance (bd6385efv) r on - 1.0 1.3 i out = 1.0a, sum of upper and lower output on resistance (bd6383efv) r on - 1.5 1.95 i out = 0.5a, sum of upper and lower output on resistance (bd6389fm) r on - 0.7 0.91 i out = 1.7a, sum of upper and lower output leak current i leak - - 10 a c u rr ent c ontr o l rnfxs input current i rnfs -2.0 -0.2 - a rnfxs =0v rnfx input current i rnf -40 -20 - a rnfx=0v vrefx input current i vref -2.0 -0.1 - a vrefx=0v vrefx input voltage range v ref 0 - 2.0 v mthx input current i mth -2.0 -0.1 - a mthx=0v mthx input voltage range v mth 0 - 3.5 v comparator threshold v cth 0.36 0.4 0.44 v vrefx=2v minimum on time t onmin 0.3 0.7 1.2 s r=39k ,c=1000pf downloaded from: http:/// technical note 3/8 bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. t e rminal function 1) bd6387efv / bd6385efv / bd6383efv pin no. pin name function pin no. pin name function 1 nc non connection 21 vcc0 power supply terminal 2 rnf1 connection terminal of resistor for output current detection 22 nc non connection 3 rnf1s input terminal of current limit comparator 23 gnd ground terminal 4 nc non connection 24 mode0 motor excitation mode setting terminal 5 out1b h bridge output terminal 25 mode1 motor excitation mode setting terminal 6 nc non connection 26 enable output enable terminal 7 out1a h bridge output terminal 27 vref2 output current value setting terminal 8 nc non connection 28 mth2 current decay mode setting terminal 9 vcc1 power supply terminal 29 nc non connection 10 nc non connection 30 cr2 connection terminal of cr for setting pwm frequency 11 cr1 connection terminal of cr for setting pwm frequency 31 nc non connection 12 nc non connection 32 vcc2 power supply terminal 13 mth1 current decay mode setting terminal 33 nc non connection 14 vref1 output current value setting terminal 34 out2a h bridge output terminal 15 select input mode select terminal 35 nc non connection 16 cw_ccw motor rotating direction setting terminal 36 out2b h bridge output terminal 17 nc non connection 37 nc non connection 18 clk clock input terminal for advancing the el ectrical angle. 38 rnf2s input terminal of current limit comparator 19 ps power save terminal 39 rnf2 connection terminal of resistor for output current detection 20 test terminal for testing (used by connecting with gnd) 40 gnd ground terminal 2) bd6389fm pin no. pin name function pin no. pin name function 1 nc non connection 19 vcc2 power supply terminal 2 cr1 connection terminal of cr for setting pwm frequency 20 nc non connection 3 mth1 current decay mode setting terminal 21 nc non connection 4 vref1 output current value setting terminal 22 out2a h bridge output terminal 5 select input mode select terminal 23 nc non connection 6 cw_ccw motor rotating direction setting terminal 24 out2b h bridge output terminal 7 clk clock input terminal for advancing the el ectrical angle. 25 nc non connection 8 ps power save terminal 26 rnf2s input terminal of current limit comparator 9 test terminal for testing (used by connecting with gnd) 27 rnf2 connection terminal of resistor for output current detection fin fin fin terminal (used by connecting with gnd) fin fin fin terminal (used by connecting with gnd) 10 gnd ground terminal 28 rnf1 connection terminal of resistor for output current detection 11 mode0 motor excitation mode setting terminal 29 rnf1s input terminal of current limit comparator 12 mode1 motor excitation mode setting terminal 30 nc non connection 13 enable output enable terminal 31 out1b h bridge output terminal 14 vref2 output current value setting terminal 32 nc non connection 15 mth2 current decay mode setting terminal 33 out1a h bridge output terminal 16 cr2 connection terminal of cr for setting pwm frequency 34 nc non connection 17 nc non connection 35 vcc1 power supply terminal 18 nc non connection 36 vcc0 power supply terminal downloaded from: http:/// technical note 4/8 bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. b l oc k di a g ram ? a p pli c ati on c i rcu i t d i a g ram ? i n p u t out put eq u i va le nt circ uit d i a g ra m fig.1 block diagram & application circuit diagram of bd6387efv/bd6385efv/bd6383efv/bd6389fm point s to noti ce for terminal de scri p ti on clk clock input terminal for advancing the electrical angle clk is reflected at rising edge. the electrical angle advances by one for each clk input. motors misstep will occur if noise is picked up at the clk terminal, so please design the pattern in such a way that there is no noise plunging. mode0,mode1 motor excitation mo de setting terminal set the motor excitation mode. mode0 mode1 excitation mode l l full step h l half step a l h half step b h h quarter step cw_ccw terminal motor rotating direction setting terminal set the motors rotating direction. change in setting is reflec ted at the clks rising edge immediately after the change in setting cw_ccw rotating direction l clockwise (ch2s current is outputted with a phase lag of 90 in regard to ch1s current) h counter clockwise(ch2s current is outputted with a phase lead of 90 in regard to ch1s current) enable terminal output enable terminal turn off forcibly all the output transistors (motor output is open). at the time of enable=l, electrical angle or oper ating mode is maintained even if clk is inputted. please be careful because the electrical angle at the time of enable being released (enable=l h) is different from the released occasion at the section of clk=h and fr om the released occasion at the section of clk l. enable motor output l open (electrical angle maintained) h active vcc1 resistor for current. detecting setting range is 0.1 ? 0.3 . bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) be sure to short vcc0, vcc1 & terminal for testing. pleaseconnect to gnd. set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k . predriver ocp current limit comp. buffer cr timer buffer current limit comp. logic translator dac ocp cr timer predriver dac logic tsd uvlo ovlo reg reset gnd vref2 cr2 mth2 vcc0 ps cl k mode0 mode1 cr1 mth1 cw_ccw enable select vref1 out1b rnf1s rnf1 vcc2 out2a rnf2s out2b rnf2 39k 1000pf 39k 1000pf test out1a 0.2 0.2 100uf 0.1uf resistor for current. detecting. setting range is 0.1 ? 0.3 . set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k . downloaded from: http:/// technical note 5/8 bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. ps power save terminal ps can make circuit standby state and make motor output open. in standby state, translator circuit is reset (initialized) and electrical angle is initialized. please be careful because there is a delay of 40 s(max.) before it is returned from standby state to normal state and the motor output becomes active. ps state l standby state (reset) h active the electrical angle (initial electrical angle) of each excitation mode immediately after reset is as follows. please be careful because the initial state at the time of fu ll step is different from those of other excitation modes. excitation mode initial electrical angle full step 45 halfstep a 0 halfstep b 0 quarter step 0 select terminal input mode switching terminal this is the terminal to set the input mode. select input mode l clk-in drive h parallel in drive p o w e r d iss ip at io n htssop-b40 package (bd6387efv/bd6385efv/bd6383efv) htssop-b40 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. also, the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power dissipation. the back metal is shorted with the back side of the ic chip, being a gnd potential, therefore there is a possibility for malfunction if it is shorted with any potential other than gnd, which should be avoided. also, it is recommended that the back metal is solder ed onto the gnd to short. please note that it has been assumed that this product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency. fig.2 htssop-b40 derating curve ambient temperature:ta[ ] power dissipation pd[w] 1.0 100 125 0 4.7w 4 3.6w 3 1.95w 2 1.6w 1 2.0 3.0 4.0 5.0 measurement machine th156 kuwano electric measurement condition rohm board board size 70*70*1.6mm 3 (with through holes on the board) the exposed metal of the backside is connected to the board with solder. board 1-layer board(copper foil on the back 0mm 2 ) board 2-layer board(copper foil on the back 15*15mm 2 ) board 2-layer board(copper foil on the back 70*70mm 2 ) board 4-layer board(copper foil on the back 70*70mm 2 ) board ja =78.1 /w board ja=64.1 /w board ja=34.7 /w board ja=26.6 /w downloaded from: http:/// technical note 6/8 bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. hsop-m36 package (bd6389fm/bd6388fm) hsop-m36 has a heat-dissipating fin terminal on the ic side, but it is possible to greatly increase power dissipation by taking a large heat dissipation pattern, such as with copper foil, on the back as well as the su rface of the board. also, this terminal is a gnd potential, therefore there is a possibility fo r malfunction or destruction if it is shorted with any potentia l other than gnd. fig.3 hsop-m36 derating curve usa ge not e s (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and supply li nes of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. users should be aware that bd6387efv, bd6385efv and bd 6383efv have been designed to expose their frames at the back of the package, and should be used with suitable heat dissipation treatment in this area to improve dissipation. as large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back surface. bd6389fm and bd6388fm are both equipped with fi n heat dissipation terminals, but dissipation efficiency can be improved by applying heat dissipation treat ment in this area. it is important to consider actual usage conditions and to take as large a dissipation pattern as possible. (6) inter-pin shorts and mounting errors when attaching to a printed circuit board, pay close attention to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between out puts or an output and the power supply or gnd. ambient temperature:ta[ ] power dissipation pd[w] 1.0 100 125 0 5.2w 4 4.1w 3 3.0w 2 2.8w 1 2.0 3.0 4.0 5.0 measurement machine th156 kuwano electric measurement condition rohm board board size 70*70*1.6mm 3 (with through holes on the board) board 1-layer board(copper foil on the back 0mm 2 ) board 2-layer board(copper foil on the back 15*15mm 2 ) board 2-layer board(copper foil on the back 70*70mm 2 ) board 4-layer board(copper foil on the back 70*70mm 2 ) board ja=44.6 /w board ja=41.6 /w board ja=30.5 /w board ja=24.0 /w downloaded from: http:/// technical note 7/8 bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. (7) operation in a strong electric field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. (8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (9) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (tsd circuit). if the chip te mperature becomes tjmax=150 , and higher, coil output to the motor will be open. the tsd circuit is des igned only to shut the ic of f to prevent runaway thermal operation. it is not designed to protect or indemnify peri pheral equipment. do not use the tsd function to protect peripheral equipment. tsd on temperature [ ] (typ.) hysteresis temperature [ ] (typ.) 175 25 (10) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, t herefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furthermore, when connecti ng to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. (11) input terminal of ic this ic is a monolithic ic, and between each element there is a p+ isolation for element partition and a p substrate. this p layer and each elements n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 4, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn) the parasitic npn transistor operates with the n la yers of other elements close to the aforementioned parasitic diode. because of the ics structure, the creation of parasitic elements is inevitable from the electrical potential relationship. the operation of parasitic elements causes interference in circ uit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes t he parasitic elements to operate, such as by applying voltage that is lower than the gnd (p substrate) to the input terminal. fig. 4 pattern diagram of parasitic element (12) ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern potential of any external components, either. (13) test terminal be sure to connect test pin to gnd. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element downloaded from: http:/// technical note 8/8 bd6383efv , bd 6385efv , bd 6387efv , bd 6389fm www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. or der in g p a rt n u mb er b d 6 3 8 3 ef v -e 2 ?` efv : htssop-b40 fm : hsop-m36 ?`?? e2: `???` ? order quantity needs to be multiple of the minimum quantity. datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
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